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Power Semiconductor Materials
Polishing Wafer
Epitaxial Wafer
Copper Metallized Ceramic Substratas(DPCs)
Direct Bonding Copper Ceramic Aubstrates (DBCs)
Power Semiconductor Wafer and Chip
SCR Chip
Power MOSFET Wafer
Diode Chip
FRED Chip
SBD Chip
Power Semiconductor Device
SCR Plastic Package
MOSFET Plastic Package
Diode Plastic Package
FRD Plastic Package
Power Semiconductor Module
Thyristor Module（MTC/MTA/MTK/MTX）
Rectifier Module（MDC/MDA/MDK）
Thyristor & Rectifier Module(MFA/MFK/MFC/MFX-DT/TD)
Single Phase Rectifier Bridge Module(MDQ)
Three Phase Rectifier Bridge Module(MDS)
FRD Module
APPLICATION
Consumer Electronics
Household appliance
Industrial application
Power grid
Automotive electronics
Photovoltaic
Contact
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Power device series products
Copper Metallized Ceramic Substrate
SCR Chip Series
Power Diode Chip Series
Power Device Series
Power Semiconductor Module Series
Power device series products
Outline Dimension Drawings
Uni‐Polar &Bi;‐Polar TVS Plastic Package
发布于
2019-05-18
有
1497
人阅读
上一篇:
SCR chip series
Tel:13705597336
Tel:13956270661
E-mail:hsdianqi@vip.163.com
Fax：0559-4510020
Huangshan Chipmirco Eletronics Co.,LTD
Add：NO.449 Xinxing road Qimen County
