Direct Bonding Copper Ceramic Aubstrates (DBCs) - Huangshan chipmirco electronics Co.,LTd

Direct Bonding Copper Ceramic Aubstrates (DBCs)：It is s basic electronic material made by directly sintering copper boxes onto the surface of ceramiv substrates,which has good thermal cycling resistance; High mechanical strength,high thermal conductivity,high insulation characteristics,and high current carrying capacity.

一、Product Application

Suitable for packaging materials for high-power IGBT modules,thyristor modules,and semiconductor refrigeration and heating devices。

二、Physical Properties

Copper layer peeling strength	≥6N/mm@50mm/min
Temperature	取决于使用环境，可适用于-55℃至850℃
bending strength	＞400N/
bending strength	＞450N/
Surface roughness	Ra≤3um
Thermal expansion coefficient	6.9ppm/k@40-400℃
Thermal expansion coefficient	7.8ppm/k@40-800℃
Thermal conductivity	24W/m.k@25℃
resistivity	＞10¹⁴Ω.cm@25℃
resistivity	＞10¹⁰Ω.cm@300℃
dielectric constant	9.8±10%@1MHz
Dielectric loss	≤0.0003@23℃，1MHz
Dielectric Strength	AC，2.5KVMRS,60HZ,1Min
Copper layer conductivity	58*10⁶S/m

三、Product selection

Copper thickmess（mm）	AI203thickness（mm）
0.05	0.635、0.76、0.89、1.0
0.25	0.25、0.32、0.38、0.635、0.76、0.89、1.0
0.3	0.32、0.38、0.635、0.76、0.89、1.0
0.4	0.32、0.35、0.38、0.635、0.76、0.89、1.0

Note1:Optional surface metal:1.Double-sided copper 2.Single-sided nicked 3.Double-sided nickel

The copper surface has an OSP anti oxidation film for soldering.

Note2:Strict product quality control Adopting fully automatic detection,automatic dotting,and X-RAY non-destructive detection methods for control.

Note3: Can be customized according to customer drawings.