Copper Metallized Ceramic Substratas(DPCs) - Huangshan chipmirco electronics Co.,LTd

Copper Metallized Ceramic Substratas （DPCs）：Sputter copper onto the surface of the ceramic substrate to form a composite base material. It has excellent electrical insulation performance, high thermal conductivity, excellent soft soldability and high adhesion strength.

一、Product Application

Mainly used for device packaging, power devices, etc.

二、Product catalog

Part Number	Satisfaction	Thickness	Dielectric Voltage Withstand	Thickness of metallayer(copper）	Tenacity
	mm（±0.1）	mm	V	µm	kg
DPC-T220	8.0*6.2	0.635±0.06	≥2500	10～15	≥20
DPC-T220	8.0*6.2	0.500±0.06	≥2500	10～15	≥20
DPC-T3P	12.0*7.8	0.635±0.06	≥2500	10～15	≥20
DPC-T3T	15.0*15.0	0.635±0.06	≥2500	10～15	≥20
DPC-M220	21.0*17.0	0.635±0.06	≥2500	10～15	≥20
DPC-M220	30.0*17.0	0.635±0.06	≥2500	10～15	≥20
DPC-M225	23.5*21.0	0.635±0.06	≥2500	10～15	≥20
DPC-M225	30.5*21.0	0.635±0.06	≥2500	10～15	≥20
DPC-M234	28.0*28.0	0.635±0.06	≥2500	10～15	≥20
DPC-M234	35.5*28.0	0.635±0.06	≥2500	10～15	≥20

Note1: The ceramic plate is coated with a thin film of copper to enable the welding between ceramics and metals.

Note2: Main application: Plastic packaging devices, power modules.

Note3: Strong adhesion (minimum tensile strength of 15kg for solder joints with a radius of 1mm);Good weldability on the metal surface of ceramic; It has an anti-oxidation film, which can be stored for a long time.

Note4: Can be customized according to customer drawings.